LPDDR5 uMCP
Brand: SAMSUNG Samsung Electronics 2. Product Name: LPDDR5 uMCP (UFS Multi-Chip Package) 3. Core Essence: Integrates LPDDR5 DRAM (running memory) and UFS 3.1 NAND flash (body storage) within a single FBGA package, enabling one chip to perform both 'running memory' and 'body hard drive' functions for smartphones. Samsung Se... 4. Package Form: 297-ball FBGA (Flip Chip Ball Grid Array), with a partitioned solder ball array visible on the right. Dimensions are 11.5×13.0mm, designed specifically for miniaturization of smartphone motherboards.