LPDDR5 uMCP
Brand: SAMSUNG Samsung Electronics 2. Product Name: LPDDR5 uMCP (UFS Multi-Chip Package) 3. Core Essence: Integrates LPDDR5 DRAM (running memory) and UFS 3.1 NAND flash (body storage) within a single FBGA package, enabling one chip to perform both 'running memory' and 'body hard drive' functions for smartphones. Samsung Se... 4. Package Form: 297-ball FBGA (Flip Chip Ball Grid Array), with a partitioned solder ball array visible on the right. Dimensions are 11.5×13.0mm, designed specifically for miniaturization of smartphone motherboards.
ification Parameters
1. Memory (LPDDR5 DRAM) Section
• Single DRAM Density: 64Gb / 96Gb (corresponding to 8GB, 12GB RAM)
• Data Rate: Up to 6400 Mbps, with a 50% increase in bandwidth compared to LPDDR4X
• Voltage: Multi-level low-power voltage regulation, adapted for 5G smartphone battery life requirements
2. Storage (UFS 3.1 NAND) Section
• Optional Flash Capacity: 128GB / 256GB
• Sequential Read Speed: 2100MB/s, Sequential Write Speed: 1200MB/s
• Equipped with Samsung's self-developed V-NAND flash hardware encryption engine
3. Mainstream Capacity Combinations
• 8GB+128GB, 8GB+256GB, 12GB+256GB, covering mid-range to near-flagship smartphone configurations
Samsung Se...